PRODUCT TYPE & SERVICES
CAPABILITY

PCB

Production Capability
Layer Counts 1L~24L , 1+N+1 HDI, MCPCB
Finish Board Thickness Min.10mils ~ Max. 128mils
Material Type FR4 Tg140~Tg180, Halogen-Free, CEM 1 & CEM 3
Copper Weight 4oz for Inner and 6oz for Outer
Copper Plating Aspect Ration 1:10
Impedance Control 50~120ohm+/-10%
Surface Finished OSP, ENIG, HASL (LF), Tin , Sliver
 

MCPCB
Production Capability
Layer Count
1L,2L   單層雙面DS    雙面雙側
Materials
 Aluminum    Copper
Min. Line Width
0.15mm
Min. Line Space
0.15mm
Finished Board Tolerance
±0.2mm
Thickness(After Lamination)
0.4mm
Surface Finished
lmmersion/electroplating silver,gold,HASL (LF), Tin 
 









 

 
 
  

PCBA

Production Capability 
LOCATION TAIWAN FACTORY 1 TAIWAN FACTORY 2 TAIWAN FACTORY 3
SMT Line 5 Lines 2 Lines 16 Lines
SMT Population 3.5M Chips/ Day 1 M Chips/day 10 M Chips/day
PTH Lines  2 Lines 1 Lines 3 Lines
Ass'y+F/T Lines 4 Lines 1 Lines 6 Lines