PRODUCT TYPE & SERVICES
PRODUCT TYPE& SERVICES
PCB MANUFACTURE
Capability
 
No. of Layer 1~24 LAYER
Material FR4; Normal TG ; High TG; Low Dk Low Df, Hi-Freq
Max. PCB Area 24”X47” (600X1200mm)
Board Thickness 0.01”~ 0.118” (0.25~3.0mm)
Lamination Thickness 0.003” (0.08mm)
Min. Drilling Size: Mechanical / Laser 0.006” (0.15mm) / 0.004”(0.1mm)
Copper Thickness(outer/inner Layer) 6oz /4 oz 
Min. Line Width and Space  (Outer & Inner) 0.003”/0.003” (3/3 mil)
Aspect Ratio 1:10
HDI 1+N+1; 2+N+2; 3+N+3
Impedance Control Tolerance +/-10%
Back Drilling Tolerance (Depth /Registration) +/-0.004” (4 mil)
Depth Control Tolerance (Depth /Registration) +/-0.004” (4 mil)
Min. Castellated Hole 0.5mm
Surface Finish Treatment HASL (LF); ENIG; Immersion Silver / Tin ; OSP(ENTEK)




Design Rule of Inner Layer



for Mechanical Drilling:
 
  Features Dimensions
Commercial Products Specialty Products
A Through hole Via Pitch (min) 24 mil(0.6mm) 20 mil(0.50mm)
B Pad edge-to-Pad edge Spacing (min) 4 mil(0.1mm) 3 mil(0.075mm)
C Line Width (min) 4 mil(0.1mm) 3 mil(0.075mm)
D Line Spacing (min) 4 mil(0.1mm) 3 mil(0.075mm)
E Via Pad / Line Spacing (min) 4 mil(0.1mm) 3 mil(0.075mm)
F N0 Function Hole to Line Spacing (min) 8 mil(0.25mm) 5 mil(0.175mm)
















For Laser Drilling:
 
  Features Dimensions
Commercial Products Specialty Products
A Through hole Via Pitch (min) 20 mil(0.435mm) 16 mil(0.4mm)
B Pad edge-to-Pad edge Spacing (min) 4 mil(0.1mm) 3 mil(0.075mm)
C Line Width (min) 4 mil(0.1mm) 3 mil(0.075mm)
D Line Spacing (min) 4 mil(0.1mm) 3 mil(0.075mm)
E Via Pad / Line Spacing (min) 4 mil(0.1mm) 3 mil(0.075mm)
F N0 Function Hole to Line Spacing (min) 8 mil(0.2mm) 5 mil(0.125mm)


​Design Rule of Outer Layer




for Mechanical Drilling:
 
  Features Dimensions
Commercial Products Specialty Products
A Via Pad / Line Spacing (min) 4 mil(0.1mm) 3 mil(0.075mm)
B Solder Mask Clearance (min) 3 mil(0.075mm) 2 mil(0.05mm)
C Solder mask Dams (min) 12 mil(0.3mm) 3 mil(0.075mm)
D Via Pad Size 4 mil(0.1mm) 16 mil(0.4mm)
E Via Hole Size (min) 4 mil(0.1mm) 8 mil(0.2mm)
F Line Spacing (min) 4 mil(0.1mm) 3 mil(0.075mm)
G Line Width (min) 4 mil(0.1mm) 3 mil(0.075mm)
H SMT Pad Spacing (min) 10 mil(0.25mm) 7 mil(0.175mm)
I SMT Pad Width (min) 8 mil(0.2mm) 7 mil(0.175mm)
J Solder mask Dams (min) 4 mil(0.1mm) 3 mil(0.075mm)
K BGA Pad Size (min)* 24 mil(0.6mm) 22 mil(0.55mm)
L BGA Hole Size (min)* 12 mil(0.3mm) 10 mil(0.25mm)

*BGA Via in Pad

For Laser Drilling:
 
  Features Dimensions
Commercial Products Specialty Products
A Via Pad / Line Spacing (min) 4 mil(0.1mm) 3 mil(0.075mm)
B Solder Mask Clearance (min) 3 mil(0.075mm) 2 mil(0.05mm)
C Solder mask Dams (min) 4 mil(0.1mm) 3 mil(0.075mm)
D Via Pad Size 14 mil(0.35mm) 12 mil(0.3mm)
E Via Hole Size (min) 4 mil(0.1mm) 4 mil(0.1mm)
F Line Spacing (min) 4 mil(0.1mm) 3 mil(0.075mm)
G Line Width (min) 4 mil(0.1mm) 3 mil(0.075mm)
H SMT Pad Spacing (min) 10 mil(0.25mm) 7 mil(0.175mm)
I SMT Pad Width (min) 8 mil(0.2mm) 7 mil(0.175mm)
J Solder mask Dams (min) 4 mil(0.1mm) 3 mil(0.075mm)
K BGA Pad Size (min)* 14 mil(0.35mm) 12 mil(0.3mm)
L BGA Hole Size (min)* 4 mil(0.1mm) 4 mil(0.1mm)
*BGA Via in Pad

Pad for Mechanical Drilling:


​​
EXAMPLE UNIT:mil ( mm)
FINISHED SIZE DRILLED
SIZE
Dimensions
HAL NI/AU OR OSP Commercial Products Specialty Products
    08.0 (0.20)   16.0 (0.40)
06.0 (0.15) 08.0 (0.20) 10.0 (0.25) 20.0 (0.50) 18.0 (0.45)
08.0 (0.20) 10.0 (0.25) 12.0 (0.30) 22.0 (0.55) 20.0 (0.50)
10.0 (0.25) 12.0 (0.30) 14.0 (0.35) 24.0 (0.60) 22.0 (0.55)
12.0 (0.30) 14.0 (0.35) 16.0 (0.40) 26.0 (0.65) 24.0 (0.60)
14.0 (0.35) 16.0 (0.40) 18.0 (0.45) 28.0 (0.70) 26.0 (0.65)
16.0 (0.40) 18.0 (0.45) 20.0 (0.50) 30.0 (0.75) 28.0 (0.70)
18.0 (0.45) 20.0 (0.50) 22.0 (0.55) 32.0 (0.80) 30.0 (0.75)
20.0 (0.50) 22.0 (0.55) 24.0 (0.60) 34.0 (0.85) 32.0 (0.80)
22.0 (0.55) 24.0 (0.60) 26.0 (0.65) 36.0 (0.90) 34.0 (0.85)

​Pad for Laser Drilling:


EXAMPLE UNIT:mil ( mm)
DRILLED SIZE DRILLED SIZE
Commercial Products Specialty Products
2.0 (0.05) TBD TBD
4.0 (0.10) 14.0 (0.35) 12.0 (0.30)
6.0 (0.15) 16.0 (0.40) 14.0 (0.35)
8.0 (0.20) 18.0 (0.45) 16.0 (0.40)